| PART |
Description |
Maker |
| MC-7883 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-7896-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| STA8058 |
GPS multi-chip module
|
ST Microelectronics
|
| MC-7881 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| CMCM |
Ceramic Multi-Chip Module Package
|
Amkor Technology, Inc.
|
| 585-2325 585-2225 585-2211 585-2413 585-2415 585-2 |
Multi-Chip BASED LED T 1 3/4 Wedge
BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation
Dialight PLC
|
| WEDPNF8M722V-1010BC WEDPNF8M722V-1015BC WEDPNF8M72 |
8Mx72 Synchronous DRAM 16Mb Flash Mixed Module Multi-Chip Package
|
WEDC[White Electronic Designs Corporation]
|
| AS8FLC2M32BP-90_IT AS8FLC2M32BP-90_Q AS8FLC2M32BP- |
Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array
|
Austin Semiconductor
http://
|
| FDMF8704 |
High Current / High Frequency FET plus Driver Multi-chip Module
|
Fairchild Semiconductor
|
| SKY77441 |
Multi-Mode / Multi-Band PA Module
|
Skyworks Solutions Inc.
|
| M39P0R8070E2 M39P0R8070E2ZADE M39P0R8070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
| TPCF8B01 |
MOSFET TPC Series
TOSHIBA Multi-Chip Device Silicon P Channel MOS Type (U-MOS III) / Schottky Barrier Diode
|
TOSHIBA[Toshiba Semiconductor]
|
